Custom housings for IoT devices, sensors, gateways, and embedded electronics. 50–500 pieces per SKU in ASA, PETG, PETG ESD, and PA-CF. Engineer-reviewed. 3–5 day turnaround.
| Volume range | 1–500 pieces per SKU |
| Typical tolerance | ±0.2–0.4 mm |
| Minimum wall thickness | 1.2 mm (material dependent) |
| Max part size | 256 × 256 × 256 mm |
| Lead time | 3–5 business days typical |
| Threaded inserts | M2–M8 heat-set inserts |
| Surface finish | Layer lines visible (FDM). Vapor smoothing for ASA. |
| File formats | STL, STEP, 3MF |
Common enclosure types manufactured for electronics and IoT hardware teams.
LoRaWAN, NB-IoT, Zigbee. Antenna windows, cable glands, DIN rail mounts.
Custom-fit to your PCB and sensor layout. Temperature, humidity, air quality.
PETG ESD for RF modules and sensitive sensor electronics. 10⁷–10⁹ Ω.
Industrial automation, building management, energy monitoring.
Standoffs, ventilation, cable routing, access panels. Threaded inserts for assembly.
Gasket grooves, cable gland provisions, UV-resistant ASA.
STL, STEP, or 3MF. Secure, NDA-ready.
DFM feedback. Material recommendation.
FDM in validated parameters.
Dimensional check. Tracked delivery.
| Material | Use case | Key property |
|---|---|---|
| ASA | Outdoor, UV exposure | 98°C HDT, UV stable |
| PETG | Indoor, snap-fit assemblies | 73°C HDT, impact resistant |
| PETG ESD | ESD-sensitive electronics | 10⁷–10⁹ Ω surface resistivity |
| PA-CF | High temp, structural | 100°C+ HDT, high stiffness |
Request an enclosure quote and receive DFM feedback and production pricing.
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